Microfocus X-Ray CT System inspeXio 7000

Význam tématu

The inspeXio 7000 microfocus X-ray CT system delivers high-resolution and high-contrast computed tomography imaging for industrial and research applications. By combining a 225 kV, 135 W X-ray generator with a 14-megapixel flat panel detector and advanced computing, this platform enables non-destructive analysis of composite materials, die-cast parts, electronics, and biological specimens.

Cíle a přehled studie / článku

This document introduces the inspeXio 7000’s design features, operational principles, performance metrics, and optional software modules. It aims to provide a comprehensive understanding of system capabilities—from automated scan setup to high-speed image reconstruction—and to illustrate typical applications in material characterization and defect analysis.

Použitá metodika a instrumentace

• X-Ray Generator: Shimadzu microfocus tube, up to 225 kV/1000 µA, optimized soft X-ray output.
• Detector: 16-inch CsI scintillator flat panel, 16-bit dynamic range, up to 14 MP input resolution.
• Stage: 360° rotation, 400 mm diameter × 300 mm height sample envelope, 20 kg capacity.
• Computing: HPCinspeXio ver. 3.0 reduces reconstruction times by ~50×.
• Software Options: ROI/Boost Reconstruction, Metal Artifact Reduction, DICOM conversion, 2D/3D image processing suites (PointMaster, VGStudio MAX, POLYGONALmeister).

Hlavní výsledky a diskuse

• High-Resolution Imaging: Achieves 14 MP cross-sectional images, enabling feature detection below 10 µm.
• High Contrast: CsI detector and improved tube window enhance visualization of low-density materials.
• Speed: Standard CT scan in ~33 s, MPR display in <10 s. Boost Reconstruction handles 2048×2048 images in <60 s.
• Artifact Reduction: ROI module diminishes truncation artifacts; metal reduction software improves clarity around dense inclusions.
• Automated Workflow: Recommend Scanning selects optimal parameters by material and resolution needs.

Přínosy a praktické využití metody

• Composite Materials: Fiber orientation analysis for GFRP/CFRTP quality control.
• Die-Cast Parts: Void detection, quantitative defect mapping, CAD comparison for machining verification.
• Electronics: BGA solder joint inspection, battery electrode spacing, polymer battery lamination integrity.
• Biomedical Research: High-resolution imaging of small animal models, uncalibrated and distortion-free CR scans.

Budoucí trendy a možnosti využití

The integration of AI-driven parameter optimization and remote diagnostics will further streamline routine inspections. Advances in detector materials and faster GPU-accelerated reconstruction promise sub-micron resolution and real-time 3D visualization, opening new possibilities in quality assurance, additive manufacturing feedback loops, and life-science imaging.

Závěr

The inspeXio 7000 system offers a robust solution for high-throughput, high-fidelity CT imaging across diverse industries. Its enhanced detector, powerful tube, and accelerated computing enable rapid, automated, and precise structural analysis, making it a versatile tool for R&D, production inspection, and advanced materials characterization.

Reference

• Shimadzu Corporation. inspeXio 7000 System Specifications and Operating Manual, 2025.
• Smart Vision Corporation. PointMaster Reverse Engineering Software Documentation.
• Volume Graphics GmbH. VGStudio MAX User Guide.
• UEL Corporation. POLYGONALmeister Software Manual.