Microfocus X-Ray Inspection System Xslicer SMX-6010

Significance of the Topic

Non-destructive X-ray imaging is critical for inspecting electronic components and assemblies to detect internal defects, verify structural integrity, and support quality control across research and manufacturing. The integration of fluoroscopy and planar CT allows comprehensive analysis of micro and macro features in miniaturized devices and multilayer boards.

Goals and Overview of the Study

The Xslicer SMX-6010 aims to deliver high-resolution planar X-ray inspection by combining a microfocus X-ray generator with a 3-megapixel flat panel detector and proprietary HDR processing. It supports seamless switching between real-time fluoroscopy and planar CT imaging to accommodate various sample geometries and sizes, from electronic parts to assembled circuit boards.

Methodology and Used Instrumentation

The system features:

• Microfocus X-ray generator: 160 kV/100 μA, integrated transformer, 1 μm resolution
• 3 MP flat panel detector with HDR image processing
• Five-axis sample stage (X, Y, Z, tilt, rotation) enabling flexible viewing angles
• Fully shielded enclosure and safety interlocks
• No external air or cooling water, 200 VAC power supply
• Planar CT (standard) and optional vertical CT modules
• Software tools: HDR processing, auto-window, teaching function, stepwise movement, panoramic stitching, BGA and area ratio measurements, wire sweep and dimension analysis

Main Results and Discussion

The Xslicer SMX-6010 achieves high dynamic range fluoroscopic images, revealing both low- and high-density regions simultaneously. CT reconstructions cover up to 350 × 350 mm within a dedicated scan area. The user interface simplifies inspection workflows: sample positioning via live images, one-click mode switching, and automated stage control. Functional testing demonstrated accurate BGA void ratio, solder area ratio, wire sweep, and dimensional measurements without extensive parameter tuning.

Benefits and Practical Applications

• Enhanced defect detection in electronic components and PCB assemblies
• Reduced inspection time through HDR imaging and automated workflows
• Versatile imaging modes supporting various sample sizes and shapes
• Integrated measurement tools for quality assurance and process control
• User-friendly UI suited for operators with varying experience levels

Future Trends and Potential Applications

Emerging directions include integration of artificial intelligence for automated defect recognition, real-time 3D visualization with advanced volume rendering, faster CT acquisition through improved detector technology, and expanded use in biomedical, automotive electronics, and materials research. IoT connectivity and cloud-based data analysis will further enhance remote monitoring and predictive maintenance.

Conclusion

The Xslicer SMX-6010 provides a comprehensive, high-precision X-ray inspection solution that streamlines workflows, improves defect detection, and supports a broad range of applications in analytical chemistry and industrial quality control.