X-ray photoelectron spectrometer - AXIS Nova

Significance of the Topic

X-ray photoelectron spectroscopy (XPS) is a versatile surface analysis technique providing quantitative elemental and chemical state information from the top 10 nm of materials.
It is widely used across microelectronics, pharmaceuticals, and materials research for defect analysis, thin film characterization, and chemical mapping.

Objectives and Article Overview

This article presents the AXIS Nova2, the latest generation high–performance, high–throughput imaging XPS spectrometer from Kratos Analytical.
It aims to highlight innovations in automation, imaging capabilities, instrumentation, and software that address the needs of demanding research and industrial environments.

Methodology and Instrumentation Used

The AXIS Nova2 integrates advanced components for enhanced performance and throughput:

• High-power monochromatic X-ray source (Al Kα standard, optional Al/Ag dual anode)
• 180° hemispherical analyser and spherical mirror analyser for spectroscopy and parallel imaging
• Multichannel plate–delay line detector supporting scanned and snapshot acquisition
• Coaxial electron-only charge neutraliser for non-conductive samples
• Automated sample handling with 110 mm diameter platens and multi–platen exchange between entry and analysis chambers
• ESCApe software for automated data acquisition, processing, array analysis, and peak identification
• Optional ion sputter sources: monatomic Ar+ and gas cluster ion source for depth profiling and minimised sample damage

Key Findings and Discussion

The AXIS Nova2 delivers exceptional spectroscopic sensitivity and resolution:

• High throughput through automated loading and platen exchange enables unattended analysis of multiple samples
• Snapshot mode captures core level spectra in under one second without scanning
• Parallel imaging with fixed transmission achieves 3 µm spatial resolution across a large field of view
• Spectromicroscopy generates over 65,000 spectra in a single dataset, suited to multivariate analysis
• Array analysis across wafers allows rapid, colour–coded elemental mapping
• Depth profiling with Ar+ or Arn+ clusters preserves interface quality in organic and inorganic multilayers

Benefits and Practical Applications

The system’s combination of automation, imaging, and software tools offers:

• Rapid, reproducible surface analysis for R&D and QA/QC laboratories
• High-sensitivity detection for trace elements and chemical states
• Non-destructive mapping of complex devices and thin films
• Enhanced depth profiling for semiconductor structures and polymer films
• Flexibility to add UPS, ISS, and angle-resolved experiments

Future Trends and Potential Applications

Anticipated developments include:

• Integration of higher-energy X-ray sources for deeper analysis
• Advanced data analytics and AI for automated interpretation of large imaging datasets
• Expanded multitechnique platforms combining XPS with UPS and ISS
• Further improvements in cluster ion technology for gentler depth profiling
• Enhanced automation and robotics for 24/7 operation in high-throughput environments

Conclusion

The AXIS Nova2 represents a significant advancement in imaging XPS, merging high performance with automation to meet stringent analytical demands.
Its versatile instrumentation and software suite enable rapid, detailed surface characterisation across a broad range of applications.