Instruments for Analyzing / Evaluating Electronic Device

Significance of the Topic

Quality control of electronic components is essential as devices become more miniaturized and feature complex material layers. Precise analysis ensures performance, reliability and compliance with regulations such as RoHS and ELV, and drives innovation in semiconductor, display and sensor technologies.

Goals and Overview of the Study

This document surveys Shimadzu’s analytical instruments and methods for inspecting electrical and electronic products. It outlines techniques for structural observation, elemental and chemical state analysis, optical property evaluation, hazardous substance detection, thermal and mechanical testing, and mass measurement.

Methodology and Instrumentation

Analytical approaches cover microscopy (electron probe microanalyzer, XPS, AFM/SPM), non-destructive imaging (X-ray fluoroscopy, CT), spectroscopic methods (IR, UV-VIS-NIR, EDX, ICP, GC/MS), thermal analysis (DSC, DTA/TG), particle sizing (dynamic image analysis), environmental monitoring (TD/HS-GCMS, ion chromatography, AA, TOC), mechanical tests (tensile, bending, compression, hardness), rheometry, and precision weighing.

Used Instrumentation

• EPMA-1720, EPMA-8050G
• KRATOS ULTRA2, KRATOS NOVA XPS
• SPM-9700HT, SPM-Nanoa, SPM-8100FM AFM/SPM
• inspeXio SMX-225CT HR Plus, SMX-100CT, Xslicer SMX series CT systems
• XDimensus 300 dimensional CT
• IRTracer-100, IRSpirit, IRAffinity-1S FTIR
• SolidSpec-3700i/3700i DUV, UV-1900i
• EDX-7200/8100, EDX-LE Plus XRF
• Py-Screener with Py-GC/MS
• HIC-ESP ion chromatography
• ICPE-9800, ICPMS-2030
• DSC-60 Plus, DTG-60(H)
• iSpect DIA-10 particle analyzer
• TD-30, HS-20 NX Trap GC/MS
• AA-7000 atomic absorption
• TOC-L CPH/CSH, TOC-1000e, TOC-4200
• AGX-V, AGS-X, EZ-X universal testers
• Microservo MMT, MCT micro testers
• DUH-211 dynamic hardness
• CFT-100EX/500EX rheometers
• AP series analytical balances

Main Results and Discussion

Submicron contaminant mapping and solder joint analysis by EPMA revealed elemental migration and film thickness. XPS imaging distinguished surface chemical states through monolayers. AFM/SPM systems resolved nanostructures in circuits and organic films, while FM-based AFM enabled atomic resolution under liquid. CT systems provided defect detection and void quantification in BGAs and connectors. FTIR and UV-VIS-NIR measured dopant levels in wafers, lubricant film thickness, and AR coatings. XRF and ICP methods screened hazardous elements and quantified layer compositions. GC/MS workflows identified VOCs, phthalates and flame retardants. Thermal analysis characterized phase transitions and material stability. Particle image analysis determined size and shape distributions. Mechanical testers assessed strength, fatigue and hardness of microcomponents, while rheometers tracked resin flow. High-precision balances supported trace weighing and buffer preparation.

Benefits and Practical Applications

• Ensures product integrity and reliability through detailed failure analysis.
• Supports environmental compliance by screening regulated substances.
• Optimizes manufacturing processes via non-destructive examinations.
• Enhances R&D by characterizing materials at nano- to macro-scales.
• Streamlines quality management in labs and production lines.

Future Trends and Potential Applications

Integration of AI and automation will enable real-time in-line inspection and data analytics. Advances in multimodal imaging will couple chemical, structural and mechanical insights. Miniaturized sensors and portable instruments will expand field testing. In-situ and operando methods will deepen understanding of dynamic behaviors in materials and devices, while greener analytical techniques will reduce environmental impact.

Conclusion

Shimadzu’s comprehensive suite of analytical tools provides versatile solutions for electronic device evaluation across scales and modalities, fostering innovation, quality assurance and regulatory adherence in the evolving electronics industry.