CCD and CID solid-state detectors
Technical notes | 2016 | Agilent TechnologiesInstrumentation
Advances in solid-state detectors have revolutionized inductively coupled plasma optical emission spectroscopy (ICP-OES) by replacing photomultiplier tubes (PMTs) with charge-coupled devices (CCDs) and charge injection devices (CIDs). These modern detectors enhance analytical flexibility, reduce analysis time through true simultaneous measurement, and improve overall instrument stability. Understanding the strengths and limitations of CCD and CID technologies is essential for practitioners aiming to optimize detection limits, throughput, and adaptability in trace element analysis.
This technical overview examines the evolution of solid-state detectors in ICP-OES, with a focus on the design and performance of the Agilent VistaChip II CCD integrated into the 5110 ICP-OES. Key aims include:
Solid-state detectors convert analyte emission photons into electrical signals. Critical aspects include:
The Agilent VistaChip II demonstrates:
Integration of the VistaChip II in the 5110 ICP-OES offers:
Ongoing developments may include:
The progression from PMTs to advanced CCD and CID detectors has markedly increased the capabilities of ICP-OES. The Agilent VistaChip II unites the high sensitivity of CCDs with the control features of CIDs, delivering fast, flexible, and reliable multi-element analysis. Its innovative cooling, integration, and anti-blooming technologies set a new standard for performance in modern analytical laboratories.
ICP-OES
IndustriesManufacturerAgilent Technologies
Summary
Importance of the Topic
Advances in solid-state detectors have revolutionized inductively coupled plasma optical emission spectroscopy (ICP-OES) by replacing photomultiplier tubes (PMTs) with charge-coupled devices (CCDs) and charge injection devices (CIDs). These modern detectors enhance analytical flexibility, reduce analysis time through true simultaneous measurement, and improve overall instrument stability. Understanding the strengths and limitations of CCD and CID technologies is essential for practitioners aiming to optimize detection limits, throughput, and adaptability in trace element analysis.
Objectives and Study Overview
This technical overview examines the evolution of solid-state detectors in ICP-OES, with a focus on the design and performance of the Agilent VistaChip II CCD integrated into the 5110 ICP-OES. Key aims include:
- Comparing CCD and CID characteristics in terms of noise, sensitivity, and readout control.
- Describing detector cooling strategies and their impact on dark current.
- Detailing innovations such as Image Mapping (I-MAP), Adaptive Integration Technology (AIT), and anti-blooming protection.
Methodology and Instrumentation
Solid-state detectors convert analyte emission photons into electrical signals. Critical aspects include:
- Detector Cooling: Peltier devices maintain detector temperatures from +15 °C down to –70 °C to minimize dark current and improve detection limits. Echelle optics permit single-detector coverage of wide spectral ranges, avoiding multiple cooled detectors.
- CCD vs. CID: CCDs offer superior sensitivity and low noise, while CIDs enable non-destructive readout (NDRO) and random access integration (RAI), allowing dynamic adjustment of integration times per pixel.
- VistaChip II Design: A custom hermetically-sealed CCD with 70 diagonal linear arrays (70,000 pixels), triple-stage Peltier cooling to –40 °C, and embedded control electronics for I-MAP, AIT, and per-pixel anti-blooming drains.
Main Results and Discussion
The Agilent VistaChip II demonstrates:
- Dark Current Performance: Approximately 7 electrons/s/pixel at –40 °C, matching cooled CIDs but without need for gas purging.
- Adaptive Integration: Real-time pixel interrogation adjusts integration times from 1 μs to 100 s, optimizing signal-to-noise across all wavelengths simultaneously.
- Dynamic Range and Speed: Duplex readout at 1 MHz per pixel supports eight orders of magnitude dynamic range and minimizes saturation risk.
- UV Sensitivity: Improved transmission in the 167–200 nm range achieved through back-illumination, silicon dioxide thinning, and off-pixel circuitry, avoiding fluorescent coatings.
Benefits and Practical Applications
Integration of the VistaChip II in the 5110 ICP-OES offers:
- Full Spectral Coverage: Single-exposure measurement from 167 to 785 nm without multiple slits or detectors.
- Enhanced Throughput: True simultaneous detection accelerates multi-element methods and transient signal analysis (e.g., chromatography, laser ablation).
- Operational Simplicity: Hermetic sealing eliminates moisture risks and maintenance associated with purged detectors.
- Robustness and Flexibility: Configurable viewing modes (radial, vertical dual view, synchronous vertical dual view) support diverse sample matrices and analytical requirements.
Future Trends and Applications
Ongoing developments may include:
- Further miniaturization and integration of readout electronics to boost UV performance and reduce costs.
- Enhanced cooling solutions balancing dark current reduction with condensation control.
- Machine-learning algorithms for dynamic method optimization and predictive maintenance.
- Expansion into hyphenated techniques and on-site portable systems leveraging solid-state detector advantages.
Conclusion
The progression from PMTs to advanced CCD and CID detectors has markedly increased the capabilities of ICP-OES. The Agilent VistaChip II unites the high sensitivity of CCDs with the control features of CIDs, delivering fast, flexible, and reliable multi-element analysis. Its innovative cooling, integration, and anti-blooming technologies set a new standard for performance in modern analytical laboratories.
References
- Agilent Technologies, Technical Overview: CCD and CID Solid-State Detectors in the 5110 ICP-OES, Publication 5991-4842EN, May 2016.
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