Thermal Analysis of Electronic Components
How to Determine the Thermal and Mechanical Properties of Electronic Materials
Program
- Introduction to electronics and PCBs
- How thermal analysis is used in the electronics industry
- Introduction to thermal analysis techniques
- Real-life application examples using DSC, TGA, TMA, and DMA
- Interactive Q&A session
The field of electronics involves components such as transistors, diodes, wires and integrated circuits, which are usually mounted on printed circuit boards (PCBs). PCBs are classified as composite material and consist of a carrier material, typically a glass fiber fabric, and a matrix such as epoxy resin.
The thermal and mechanical properties of electronic components have a significant effect on their use case and lifetime. For example, PCBs can suffer from delamination at high temperatures. Thermal analysis can be used to characterize many types of components and to guide design and production processes.
Join our upcoming webinar to find out how thermal analysis is used to investigate materials used in the electronics industry. We will present real-life examples of samples measured by DSC, TGA, TMA, and DMA. Understand your material behavior and boost your thermal analysis knowledge.
How Is Thermal Analysis Used for Characterizing Electronic Components?
The most important effects that can be analyzed by DSC for the electronics industry are curing, glass transitions, crystallization, and melting temperature. DSC is also used to determine the heat of fusion, and oxidation stability.
- TGA measures weight changes. The main applications of TGA are thermal stability, decomposition kinetics, and the analysis of composition.
- TMA is normally used to study the expansion, shrinkage, and softening of materials and the glass transition.
- DMA is used to determine the modulus and damping behavior of materials.
Don’t miss this opportunity to gain in-depth knowledge on characterizing electronic materials, such as PCBs, adhesives, solder, metals, alloys, composites, and plastics. Register now to secure your spot, and be sure to prepare your questions for our experts!
Presenter: Angela Hammer (Dr. sc. nat. ETH)Dr. Angela Hammer received a Ph.D. in Analytical Chemistry (development of immobilized components for the use in ion-selective electrodes based on polyurethane membranes) from the Institute of Organic Chemistry at the Swiss Federal Institute of Technology in Zürich, Switzerland. She then joined Sika Technology AG in Zurich, Switzerland, as an analytical chemist. In 2007, she joined METTLER TOLEDO and has worked there since as an application specialist for Thermal Analysis. In her present position, she uses, teaches, and supports DSC, TGA, TMA, and DMA instruments for the METTLER TOLEDO’s Materials Characterization Group located at the head office in Switzerland.
