Dynamic Ultra Micro Hardness Tester DUH-211/210 Series

Significance of the Topic

The ability to characterize mechanical properties at micro- and nano-scale depths is critical across materials science, semiconductor manufacturing and quality control. Instrumented indentation that records force versus penetration depth enables quantitative evaluation of thin films, surface-treated layers, polymers and soft materials where conventional macro-hardness testing fails. Compliance with ISO 14577-1 (Annex A) and ISO/TS 19278 allows comparable, standardised reporting of hardness, elastic modulus and time-dependent deformation (creep) for a very wide range of industrial and research applications.

Objectives and Overview of the System

This document describes the Shimadzu DUH-211/210 Series Dynamic Ultra Micro Hardness Tester family (models DUH-211/211S, DUH-210/210S). The system is designed to: measure instrumented indentation data with high depth resolution; evaluate Martens hardness, indentation hardness and indentation elastic modulus (EIT) per ISO 14577-1 Annex A; and enable ISO/TS 19278-compliant plastic testing so different plastics can be compared on a common scale. The platform targets thin films, DLC and vapor-deposited coatings, ion-implanted and nitride layers, plastics, rubbers, brittle ceramics and fine particulate specimens and fibers.

Methodology and Measurement Principles

The DUH series uses an electromagnetic actuator to apply a controlled loading waveform to a diamond indenter while a high-resolution displacement sensor tracks penetration depth. Key methodological points:

• Dynamic recording of force (F) and indentation depth (h) during load and unload phases, enabling calculation of hardness as a function of depth and derivation of elastic/plastic partitioning of work.
• Standard indenter geometry is a 115° triangular pyramid (Berkovich-type triangular pyramid expression); optional indenters include a 100° triangular pyramid, Vickers and Knoop for converted hardness metrics.
• Hardness expressions are provided both as dynamic hardness (function of F/h2) and as Martens hardness per ISO 14577-1 Annex A; diagonal-measured Vickers/Knoop hardness is available when indentations are optically resolvable.
• Elastic modulus (EIT) is determined from the slope of the initial unloading tangent with area calculations corrected for indenter geometry and instrument compliance; Poisson’s ratio of the specimen may be entered for conversion to Young’s modulus.
• Work partitioning (elastic vs plastic) is evaluated by numerical integration of F·dh over loading/unloading cycles; creep and indentation-rate dependent parameters are supported.
• The Tangent Depth method is implemented to better relate indentation-derived moduli to tensile-test Young’s modulus and to provide an equivalent indentation Vickers hardness (HVI) for thin films and coatings.

Instrumentation Used

Principal components and notable specifications:

• Models: DUH-211 / DUH-211S (high-resolution variants) and DUH-210 / DUH-210S.
• Loading: Electromagnetic coil actuator. Full-scale test force range 0.1 to 1,961 mN. Force control resolution as fine as 0.196 μN (DUH-211S/210S for forces ≤1.96 mN); standard force accuracy ±19.6 μN or ±1% of displayed force.
• Displacement sensing: Differential transformer. Measurement ranges 0–10 μm or 0–100 μm with depth resolution down to 0.0001 μm (DUH-211S/211) and 0.001 μm for larger range; linearity ±2% full scale.
• Standard indenter: 115° triangular pyramid (tip angle 115°). Optional indenters: 100° triangular pyramid, Vickers, Knoop. Indenter-tip shape correction available for the 115° triangular pyramid.
• Optical monitoring: Integrated reflected-light microscope with ×500 total magnification standard; optional ×10–×100 objectives and a length-measurement CCD kit (color or monochrome) for image capture and diagonal measurement up to an effective ×1300 display magnification.
• Stage: Manual XY stage with ~25 mm travel; optional electric XY (±25 mm) and electric Z stages for automated mapping; auxiliary holders for slender or thin samples and vacuum wafer suction plate.
• Data system: PC-based control and analysis software (Windows 11 recommended). Outputs include force–depth, hardness–depth, depth^2–force plots, ASCII exports and ISO-compliant parameter calculations.
• Environmental controls: Active vibration-absorbing bench options, windbreak enclosures and installation guidance for temperature and low-vibration operation to preserve sub-micrometer performance.

Main Results and Discussion (Capabilities and Example Applications)

The DUH series enables quantitative surface and near-surface mechanical characterization across diverse specimen classes:

• Thin films/coatings: By using ultra-low test forces and high depth resolution (sub-micrometer to nanometer-scale), the instrument isolates film responses from substrate influence when indentation depths are kept below ~10% of film thickness. Demonstrated for SiO2 films (1 μm), DLC coatings and PVD/CVD layers.
• Polymers/rubbers: Instrumented indentation overcomes optical limitations for low-reflectivity plastics and allows evaluation of elastic recovery and creep in elastomers where post-test indentations may not persist.
• Brittle materials: Low-force tests reduce cracking risk in ceramics and glass, while the system can also quantify crack-initiation forces.
• Microelectronics and fine features: Micro-region hardness of patterned semiconductors, solder bumps and gold studs is accessible with both load–unload and cyclic/step-loading protocols.
• Particulates and fibers: Compression-like indentation on single particles (e.g., zirconia, carbon fibers) provides detailed hardness/stiffness information for powders and composite constituents.

Discussion points: the combination of high force resolution, sub-nanometer depth sensitivity and standards-compliant algorithms (ISO 14577-1, ISO/TS 19278) yields reproducible Martens hardness (HM), indentation hardness (HIT), indentation elastic modulus (EIT), and work partition metrics (ηIT). Tangent Depth and equivalent indentation Vickers hardness offer improved correlation with bulk tensile moduli for thin layers.

Benefits and Practical Use

• Non-reliant on optical measurement of indentation size: depth-based evaluation is effective for dark, rough or elastically recovering materials.
• Minimal sample damage: low-force capability prevents cracking and large-scale deformation, enabling testing of thin films and fragile specimens.
• Standards compliance: ISO 14577-1 Annex A and ISO/TS 19278 modes facilitate inter-laboratory comparability and standardized reporting for metals and plastics.
• Flexible test modes: load–hold, load–unload, cyclic, depth-setting and step-loading protocols cover static hardness, fatigue-like cycling and creep analyses.
• Expandable hardware and accessories: electric stages, high-magnification imaging, active vibration control and specialized holders support automation and specialized sample geometries.

Future Trends and Potential Applications

• Tighter integration with automated mapping and robotic sample handling to produce high-throughput mechanical maps across wafers and coated substrates.
• Advanced tip-shape characterization and inverse modelling to improve modulus and contact-area corrections for non-ideal indenter geometry and nanoscale tip rounding.
• Machine-learning-assisted interpretation of indentation curves to classify material behavior, detect coating delamination or identify localized heterogeneities from large datasets.
• Combination with complementary microscale tests (micro-compression, nano-DMA, AFM-based mechanical mapping) for multimodal mechanical characterisation workflows.
• Enhanced in-situ environmental control (temperature, humidity, atmosphere) for testing under realistic service conditions and accelerated ageing studies.
• Expansion of international standards to better harmonize equivalent hardness metrics across indenters and instruments, simplifying cross-platform comparisons.

Conclusion

The Shimadzu DUH-211/210 Series delivers a standards-aligned, high-resolution instrumented indentation solution for probing surface and micro-scale mechanical properties. Its low-force capability, sensitive depth measurement and versatile test modes make it suitable for thin films, polymers, elastomers, brittle ceramics, fine particles and microelectronic features. Combined with optional imaging, stage automation and vibration control, the DUH family supports both fundamental materials research and industrial quality control requiring reproducible, ISO-compliant indentation data.

Reference

• ISO 14577-1 Metallic materials — Instrumented indentation test for hardness and materials parameters — Part 1: Test method (Annex A: materials parameters from force/indentation depth datasets).
• ISO/TS 19278 Plastics — Instrumented micro-indentation test for hardness measurement.
• Journal of Material Testing Research Association of Japan, Vol. 62, No. 2, April 2017 — Proposal for ISO 14577 Part 1: Verification of Young’s modulus calculation method for broad material and force ranges.
• Journal of Material Testing Research Association of Japan, Vol. 65, No. 1, January 2020 — Theory and implementation of Equivalent Indenting Vickers hardness HVI(IW) across forces from 10 mN to 1960 mN.
• Shimadzu Corporation, DUH-211/210 Series brochure and specifications (First Edition June 2006; © Shimadzu Corporation, 2026).