Advanced ICP-OES Analysis of Plating Baths: Precision, Sensitivity, and Robust Process Control
Are you facing challenges in monitoring complex plating bath matrices? Join our live webinar on November 13th to explore how state-of-the-art ICP-OES instrumentation—featuring DSOI plasma observation technology—delivers enhanced sensitivity and matrix tolerance for the detection and quantification of key elements in electroplating and electroless deposition processes.
We’ll cover:
- The chemistry and process control requirements for plating baths, including major, minor, and trace element analysis.
- Strategies for overcoming high matrix concentrations, spectral interferences, and dynamic range demands.
- Real-world application data for nickel and copper baths, including spike recovery results, detection limits, and regulatory compliance.
- How the SPECTROGREEN ICP-OES enables fast, accurate, and reliable measurements—even in the most challenging environments.
Discover how you can optimize bath composition, ensure product quality, and meet environmental regulations with confidence. This session is ideal for laboratory professionals, process engineers, and anyone seeking deeper insight into analytical best practices for plating solutions.
The webinar will take place on Thursday, November 13, and will take around 30 minutes, after which we'll answer your questions live.
Presenter: Johanna Buss
As Associate Product Manager for the ICP-OES product line, Johanna Buss supports the further development of the product line and offers SPECTRO customers worldwide support with questions about the instrument and the development of specific applications. Before joining SPECTRO in 2021, she worked with ICP-OES instruments at the Department of Applied Geology at the University of Münster.
