New insights from Semiconductor Failure Analysis with TESCAN's Integrated Workflow

A Comprehensive Approach to Semiconductor FA

Do you wish to stay abreast of the ever-evolving landscape of semiconductor technology and its impact on device efficiency and reliability? Join us on January 23rd, 2024, for a captivating webinar that will expand your perspective on semiconductor failure analysis.

Webinar Title: “Streamlining Millimeter-Scale Semiconductor Failure Analysis: An Integrated Workflow with Plasma FIB-SEM, Laser Techniques, and Advanced FA Tools”

This online session promises to bring new insights for professionals in the semiconductor industry.

What to Anticipate:

• Navigating the Miniaturization Maze: Discover how advancements in miniaturization, component integration, and optimization are transforming the performance and power consumption of electronic devices, including displays and batteries.

• The Imperative of Rapid Failure Analysis: Learn about the escalating challenges in detecting defects beneath complex surfaces and the critical role of swift and accurate failure analysis in accelerating market readiness and ensuring device dependability.

• Innovations in Workflow Integration: Explore the dynamic integration of plasma FIB technology with high-speed laser ablation techniques (3D-Micromac microPREP™ PRO), enhancing the speed and precision of semiconductor failure analysis.

• Introducing TESCAN’s Large Volume Workflow Update: Delve into the latest enhancements, developed in collaboration with the European FA4.0 project, including a versatile shared sample holder and the pioneering Essence AutoSection™ software for automated alignment and ROI identification.

What You Will Gain

Participants will be treated to practical demonstrations on a variety of challenging samples, showcasing the workflow’s adaptability in handling complex devices and non-conductive materials.

Together, we will learn how these state-of-the-art techniques enable rapid, artifact-free sample preparation, essential for ultra-high-resolution SEM imaging and comprehensive failure root-cause analysis.

Presenter: Lukas Hladik (Product Marketing Manager at TESCAN Group)