Damage-free failure/defect analysis in electronics and semiconductor industries using micro-ATR FTIR imaging

Význam tématu

Failure and defect analysis in electronics and semiconductor manufacturing is critical to maintain productivity and minimize costly downtimes. As device dimensions shrink and process complexity increases, even microscopic contaminants can lead to yield loss, production halts, and multimillion‐dollar losses. Rapid, non-destructive techniques that provide detailed chemical and spatial information are therefore essential for timely root‐cause identification and remediation.

Cíle a přehled studie / článku

This application note demonstrates the use of micro-ATR FTIR imaging for damage-free failure and defect analysis of delicate electronic components. Two case studies—a fragile LCD color filter and a printed circuit board (PCB)—show how the Agilent Cary 620 FTIR imaging system can accurately identify submicron contaminants and reduce analysis time to minutes, enabling manufacturers to quickly trace contamination sources and resume production.

Použitá metodika

Samples were analyzed in micro-ATR mode without any special pretreatment. Each component was simply placed on a motorized microscope stage and brought into contact with a germanium ATR crystal. The live FPA imaging feature provided real-time feedback to ensure optimal but gentle pressure, preserving sample integrity throughout the analysis. Spectral data were acquired simultaneously from every pixel to yield comprehensive chemical maps.

Použitá instrumentace

The study employed an Agilent Cary 620 FTIR microscope coupled to an Agilent Cary 660 FTIR spectrometer and a 64×64 focal plane array (FPA) detector. Key operating parameters included:

• Spectral resolution: 8 cm⁻¹
• Scans per pixel: 128
• Wavenumber range: 4000–900 cm⁻¹
• Spatial resolution: 1.1 µm/pixel
• Field of view: 70×70 µm
• Total spectra per image: 4096
• Total acquisition time: ~4 minutes

Hlavní výsledky a diskuse

Case Study 1: LCD Color Filter
The micro-ATR FTIR chemical image at 1017 cm⁻¹ revealed particulate contaminants on the filter surface. Spectral library matching identified these specks as polymer spacer material dislodged after assembly. The entire analysis, including imaging and spectral identification, was completed in under five minutes without sample damage.

Case Study 2: Printed Circuit Board
A PCB contaminated with unknown residues exhibited a damaged region from a failed prior analysis. Using the Agilent live ATR imaging approach, a 70×70 µm chemical image at 1720 cm⁻¹ exposed residue composition as polyetherimide, confirming inadequate post-manufacture cleaning. Rapid identification enabled prompt corrective actions.

Přínosy a praktické využití metody

Micro-ATR FTIR imaging offers:

• Non-destructive analysis of fragile electronics
• No extensive sample preparation
• High spatial resolution down to 1 µm
• Simultaneous acquisition of thousands of spectra
• Rapid identification of contaminants and failure modes
• Reduced manufacturing downtime and improved yield

Budoucí trendy a možnosti využití

Emerging directions include integration of AI-driven spectral interpretation, higher-density detector arrays for submicron resolution, and real-time inline monitoring during production. Combining FTIR imaging with complementary modalities such as Raman mapping or X-ray microscopy may further enhance defect characterization and process control.

Závěr

The Agilent Cary 620 FTIR chemical imaging system enables fast, non-destructive identification of microscopic contaminants on delicate electronic components. With minimal sample preparation, high spatial and spectral resolution, and user-friendly operation, this approach significantly reduces analysis time and production downtime, helping manufacturers maintain high yield and product quality.

Reference

No external literature references were provided in the original application note.